Firstack Driver Solution Distributor | SK, ED-WP Line
Genuine Firstack driver solutions with master-slave architecture for press-pack, 3-level NPC/ANPC and SiC modules up to 4500 V.
Firstack Driver Solution Overview
BeiLuo supplies genuine Firstack gate driver solutions, which use an innovative master board plus slave board architecture to combine a standardised, reliable drive performance with configurable flexibility. The master board provides the digital control, the protection and the fault handling, while the configurable slave board adapts to different IGBT and SiC modules and application topologies, so a designer integrates a new module or a new converter topology without a full driver redesign. Firstack's digital technology delivers lower electromagnetic interference than analog drivers and adds high reliability, high flexibility and high intelligence, with a protection set that includes short-circuit detection, undervoltage lockout, soft shutdown, active clamping and, where needed, di/dt protection. The solution line covers single-channel and multi-parallel drivers for press-pack modules up to 4500 V, and multi-parallel drivers for 3-level NPC and ANPC topologies at 1700 V, as well as 6 W drivers for compact SiC modules at 3300 V. That range serves rail traction, photovoltaic and wind power, energy storage and motor drives. Every device BeiLuo ships is factory-traceable and includes an import declaration, a certificate of origin and a RoHS compliance file. Our FAE team helps you configure the slave board for your module, set the protection and verify the design on the bench.
Firstack Driver Solution Product Range
In-stock Driver Solution series available now, each with import documentation and FAE support. Click a model for full specifications and purchase information.
Frequently Asked Questions
What is a master-slave driver solution?
The master board provides the digital control, protection and fault handling, and the configurable slave board adapts to a specific module and topology. That lets a designer integrate a new module without redesigning the whole driver, combining standardised reliability with customisable flexibility.
It shortens the development cycle for a changed power stage.
Which solution suits a 3-level converter?
The ED-WP-CB is a 4 W / 110 A driver core for multi-parallel 3-level NPC and ANPC topologies at 1700 V, with SSD, UVLO, fault sequencing and NTC detection. It suits photovoltaic, wind and storage converters that use a 3-level topology.
Our FAE team can review your 3-level design.
Which solution suits a press-pack module?
The SK08110 is a single-channel 8 W / 110 A driver for press-pack modules up to 4500 V, with multi-level topology support, di/dt protection and active clamping. It suits rail and high-voltage DC transmission.
Request a press-pack driver review.
Can you help configure the slave board?
Yes. Send your module, the converter topology and the switching frequency, and our FAE team will help configure the slave board, set the gate resistors and protection, and confirm the design on the bench.
That support shortens the path to production.
Documentation
Need a quote or samples?
Request pricing, samples or technical consultation for Firstack Driver Solution products. Our FAE team responds within one business day.
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